Question

A silicon carbide plate fractured in bending when a blunt load was applied to the plate center. The distance between the fracture origin and the mirror/mistboundary on the fracture surface was 0.796 mm. To determine the stress used to break the plate, three samples of the same material were tested and produced the following. What is the estimate of the stress present at the time of fracture for the original plate

Answer 1

hello your question has some missing values below are the missing values

Mirror Radius (mm) Bending Failure Stress (MPa)

.603 225

.203 368

.162 442

answer : 191 mPa

Step-by-step explanation:

Determine the stress present at the time of fracture for the original plate

Bending stress ∝ 1 / ( mirror radius )^n ------ ( 1 )

at 0.603 bending stress = 225

at 0.203 bending stress = 368

at 0.162 bending stress = 442

applying equation 1 determine the value of n for several combinations

( 225 / 368 ) = ( 0.203 / 0.603 )^n

hence : n = 0.452

also

( 368/442 ) = ( 0.162 / 0.203 ) ^n

hence : n = 0.821

also

( 225 / 442 ) = ( 0.162 / 0.603 ) ^n

hence : n = 0.514

Next determine the average value of n

n ( mean value ) = ( 0.452 + 0.821 + 0.514 ) / 3 = 0.596

Calculate estimated stress present at the time of fracture for the original plate

= bending stress at x = 0.796 / bending stress at x = 0.603

= x / 225 = ( 0.603 / 0.796 ) ^ 0.596

therefore X ( stress present at the time of fracture of original plate )

= 225 * 0.84747

= 191 mPa