Final answer:
The principle mode of failure for a conventional plating construct is material failure, which occurs when a mechanical load causes fracture or breakage of the plating material. However, in biomolecular adhesions, failure occurs in a stochastic manner, where adhesion can unbind and rebind from the surface.
Step-by-step explanation:
The principle mode of failure for a conventional plating construct is typically associated with material failure. When a mechanical load is exerted on the construct, it may lead to fracture or breakage of the plating material. However, in the case of biomolecular adhesions, which are on a smaller scale, failure does not typically occur at sharp stability thresholds but rather in a stochastic manner, where adhesion can unbind and rebind from the surface. This is related to the weak interaction scales of soft matter.