Final answer:
The primary objective of bonding is to achieve electrical safety and continuity with a pathway that has low dc resistance for efficient current flow and high RF impedance to reduce interference.
Step-by-step explanation:
The primary objective of bonding is to ensure electrical safety and to maintain electrical continuity. This is typically achieved by creating a pathway with low dc resistance to ensure that electric currents can flow easily without significant energy losses. At the same time, for radio frequency (RF) applications, having high RF impedance is beneficial for reducing interference. Hence, the correct answer is that the primary objective of bonding is to provide an electrical path of low dc resistance and high RF impedance.