Final answer:
The placement of contact pins in PGA (CPU) and LGA (socket) packaging is reversed from the question's statement, making it false. High-voltage wires are not insulated but are held by insulating connectors, also false. In a circuit diagram, voltage is not the same at every point in a wire, false as well.
Step-by-step explanation:
The statement regarding the placement of contact pins in Pin Grid Array (PGA) and Land Grid Array (LGA) is false. In a Pin Grid Array (PGA) package, the contact pins are located on the Central Processing Unit (CPU) itself, protruding downwards. These pins fit into corresponding holes in the socket. Conversely, in a Land Grid Array (LGA) package, the pins are found on the socket and the CPU has flat contacts on its underside that touch these pins when installed. This physical difference influences how these CPUs are installed onto motherboards and also their potential for damage during installation.
As for the high-voltage wires question, the assertion is false. High-voltage wires are indeed suspended by insulating connectors to prevent electricity from grounding, but the wires themselves are not wrapped in insulating material. They are bare due to the high voltage they carry, and the air surrounding them acts as an insulator.
Lastly, in regards to the circuit diagram question, the idea that voltage is the same at every point in a given wire is false. Voltage can differ across different points in a circuit depending on the presence of components such as resistors that can create a voltage drop.