Question

In a manufacturing process, a transparent film is being bonded to a substrate as shown in the sketch. To cure the bond at a temperature "To", a radiant source is used to provide a heat flux, all of which is absorbed at the bonded surface. The back of the substrate is maintained at T1 while the free surface of the film is exposed to air at a certain temperature shown below with a corresponding heat transfer coefficient h. Given the values below, determine the required heat flux to maintain bonded surface temperature at 60C (answer in W/m2)

Answer 1

To maintain the required temperature of the bonded surface, the needed heat flux is calculated by considering both conductive heat transfer within the substrate and convective heat loss at the film's surface, potentially using the Stefan-Boltzmann law and specific heat capacity.

Step-by-step explanation:

The student is asking about the rate of conductive heat transfer in a manufacturing process involving a transparent film bonded to a substrate. The problem involves maintaining a specific temperature at the bonded surface by applying a heat flux from a radiant source and taking into account the cooling effect due to air exposure on the other side.

Using the provided temperature of the bonded surface (To), the temperature at the back of the substrate (T1), the ambient temperature, and the heat transfer coefficient (h), we need to apply principles from thermodynamics to calculate the required heat flux. This usually involves equations relating to conductive and convective heat transfer, possibly including the constants for specific heat capacity and the Stefan-Boltzmann law for radiation if pertinent.