Question

Which of the following is true about the tests run during wafer probing? elect one:

a. None of these
b. A full set of tests are run on each chip using automated test equipment (ATE), to make sure that the chip meets all the specifications
c. Chips which pass all tests are inked to identify them after the wafer has been sawed into individual chips, so they can be packaged
d. Both low and high frequency tests are run to assure good performance
e. Wafer probes are used to test each chip before the wafer is sawed into individual chips to be packaged

Answer 1

Wafer probes are used to test each chip before the wafer is sawed into individual chips to be packaged.

Step-by-step explanation:

The correct answer is e. Wafer probes are used to test each chip before the wafer is sawed into individual chips to be packaged. During the wafer probing process, wafer probes are used to test the electrical performance and functionality of each chip on the wafer. This helps identify any faulty or defective chips before they are packaged and shipped. Once the wafer has been probed, it is then sawed into individual chips, and only the chips that pass the testing are selected for packaging.