Question

Assume that component with 256 I/Os what s offered in three forms : QFP is 0.4mm and the lead length is 1mm. An edge that has of the QFP to the center of the nearest lead is assumed to the same as the lead pitch . The pitch of the BGA Has s 1.27mm and edge to the center of the nearest solder joint is 2.5mm(fully arrayed) . The pitch of the flip chip is 0.1mm and an edge to the center of the nearest solder is 0.2mm (fully arrayed) . Assume the underfill extension is 0.2mm . Calculate the PCB surface area requirement for each cases .

Answer 1

Step-by-step explanation:

. There are commercial sockets available for

1.00-mm and 0.8-mm pitch package burn-in.

Sockets for 0.5-mm pitch packages are now

becoming available. Vendors include Texas

Instruments, Yamaichi, Wells and Enplas. The ball

damage observed falls within specified tolerances,

so the testing does not affect board mount