Final answer:
Thermal compound should be applied between the CPU and heat sink during motherboard installation to ensure efficient heat transfer and cooling.
Step-by-step explanation:
When installing a new motherboard, thermal compound must be applied between the processor (CPU) and the heat sink. The thermal compound, also known as thermal paste, improves the heat transfer from the CPU to the heat sink, which is critical for efficient cooling. A CPU generates a significant amount of heat, and without proper thermal conductivity, it may overheat, leading to potential damage or system instability. It's important to apply the compound correctly for optimal heat dissipation.
When installing a new motherboard, thermal compound must be applied between the CPU and the heat sink. The CPU (Central Processing Unit) is the main component of the motherboard that performs calculations and executes instructions. The heat sink is a device that helps dissipate heat generated by the CPU.