Final answer:
The melting and boiling points of different types of bonds vary. Ionic compounds have the highest melting and boiling points due to strong electrostatic interactions. Covalent network compounds have high melting and boiling points as well, followed by metallic compounds, and molecular compounds have the lowest melting and boiling points.
Step-by-step explanation:
When comparing the melting and boiling points of different types of bonds, we find that ionic compounds generally have the highest melting and boiling points, followed by covalent network compounds, metallic compounds, and then molecular compounds. Ionic compounds have strong electrostatic interactions between ions, resulting in high melting and boiling points. Covalent network compounds, such as diamond, have a network of covalent bonds extending throughout the entire crystal, which also leads to high melting and boiling points. Metallic compounds have a lattice of positive metal ions with delocalized electrons, resulting in moderate melting and boiling points. Finally, molecular compounds, which are held together by weaker intermolecular forces, have the lowest melting and boiling points.